Which is better, liquid flux or paste flux?
In the realm of soldering and electronics assembly, the choice between liquid flux and paste flux often begs the question: which is better? Liquid flux, known for its thin, liquid-like consistency, offers quick and even coverage, making it a popular choice for through-hole soldering. However, its tendency to drip or run off the surface can be a challenge. Conversely, paste flux, with its thicker, paste-like texture, provides a more controlled application and adhesion to the soldering surface, reducing the risk of excess or spillage. But, its thicker consistency may not be as suitable for all applications. So, the question remains: is the even coverage and speed of liquid flux outweighed by the controlled application of paste flux, or vice versa? Which do you believe offers the best balance of performance and convenience?